1. Continuous Wet Coating: Types and Maximum Thickness
Hard Gold (Au)
1μ-100μ
Wire Bondable Gold (Au)
1μ-100μ
Soft Gold (Au)
1μ-30μ
Palladium-Nickle (Pd-Ni)
15μ-100μ
Silver (Ag)
80μ-250μ
Copper (Cu)
50μ-100μ
Matt Nickle (Ni)
30μ-150μ
Semi-bright Nickle (Ni)
30μ-150μ
Bright Pure Tin (Sn)
40μ-250μ
Matt Pure Tin (Sn)
40μ-250μ
Chemical Lubrication
Pore Protection Boosting
2. Selective Plating Process Capabilities for Sheet Materials
Location tolerance
±0.1mm
Number of Location
Multiple
3. Specifications for Black Ceramic Composite Material
Sheet resistance (Glass substrate)
: 5Ωmin by Four Point Probe
Sheet resistance (Nickel substrate)
: 0.5mΩmin by Four Point Probe
Reflectivity
: 15-40 by PL Spectrometer
Film thickness
: 200nm-700nm
4. Characteristics and Capabilities of Copper Electroforming
Thickness
Max 500μ
Max size allowed
550x450 mm
5. Characteristics and Capabilities of Nickel Electroforming
Internal stress
＜50MPa
Hardness
150-170Hv
Thickness
Max 500μ
Max size allowed
550x450 mm
6. Substrates suitable for Wet Process
Copper & its alloys (non-toxic)
Copper beryllium
Steel
Stainless steels
Nickel
Nickel alloys
Aluminum & its alloys (Batch process)
Zinc & its alloys (Die-casting / Batch process)
7. Substrates Suitable for PVD Processes
Copper & its alloys (non-toxic)
Copper beryllium
Steel
Stainless steels
Nickel
Nickel alloys
Aluminum & its alloys (Batch process)
Zinc & its alloys (Die-casting / Batch process)
Glass
PC/ABS/PET/PBT/Nylon/Acrylics/PI/PEEK...